MANUFACTURING METHOD OF WIRING BOARD, WIRING BOARD, AND WIRING BOARD INTERMEDIATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of suppressing film thickness nonuniformity of a conductive layer in the conductive layer including a line thin-line part and a wide-area region that is a region wider than a width of the thin-line part.SOLUTION: The manufacturing method of the wiring board including a hydrophilic/hydrophobic pattern substrate and the conductive layer formed on a surface of the hydrophilic/hydrophobic pattern substrate includes: a first application step of applying a coating liquid for linear conductive layer formation onto a hydrophilic region of the hydrophilic/hydrophobic pattern substrate including a hydrophilic thin-line part and a hydrophilic outer frame part having a width equal to that of the hydrophilic thin-line part to form a linear conductive layer including the thin-line part and the outer frame part; a first solidification step of solidifying the linear conductive layer; a second application step of applying a coating liquid for planar conductive layer formation to a region inside of the outer frame part on a surface of the hydrophilic/hydrophobic pattern substrate in accordance with a discharge method to form a planar conductive layer; and a second solidification step of solidifying the planar conductive layer.