| 摘要 |
PROBLEM TO BE SOLVED: To efficiently properly perform processing for removing a liquid on a surface of a substrate formed with a pattern.SOLUTION: In a removal process of a rinse liquid R on a surface 10a of a wafer 10 formed with a resist pattern 11, in a state where the rinse liquid R exists on the surface 10a of the wafer 10, a template 20 is disposed so as to face the surface 10a of the wafer 10 and be in contact with the rinse liquid R. Then, in a state where an interval between the wafer 10 and the template 20 is kept constant, the rinse liquid R is drained and removed. |
