发明名称 ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK
摘要 An ESD cell includes an n+ buried layer (NBL) within a p-epi layer on a substrate. An outer deep trench isolation ring (outer DT ring) includes dielectric sidewalls having a deep n-type diffusion (DEEPN diffusion) ring (DEEPN ring) contacting the dielectric sidewall extending downward to the NBL. The DEEPN ring defines an enclosed p-epi region. A plurality of inner DT structures are within the enclosed p-epi region having dielectric sidewalls and DEEPN diffusions contacting the dielectric sidewalls extending downward from the topside surface to the NBL. The inner DT structures have a sufficiently small spacing with one another so that adjacent DEEPN diffusion regions overlap to form continuous wall of n-type material extending from a first side to a second side of the outer DT ring dividing the enclosed p-epi region into a first and second p-epi region. The first and second p-epi region are connected by the NBL.
申请公布号 US2015340357(A1) 申请公布日期 2015.11.26
申请号 US201514713785 申请日期 2015.05.15
申请人 Texas Instruments Incorporated 发明人 EDWARDS HENRY LITZMANN;SALMAN AKRAM A.;HU BINGHUA
分类号 H01L27/02;H01L29/10;H01L21/8222;H01L21/265;H01L21/763;H01L21/762;H01L27/06;H01L29/06 主分类号 H01L27/02
代理机构 代理人
主权项 1. An integrated circuit (IC), comprising: a substrate having a p-type epitaxial (p-epi) layer thereon; an n+ buried layer (NBL) within said p-epi layer which defines a buried portion of said p-epi layer (buried p-epi layer) below said NBL; an outer deep trench isolation ring (outer DT ring) comprising at least a dielectric sidewall having a deep n-type diffusion (DEEPN diffusion) configured in a ring (DEEPN ring) in said p-epi layer layer contacting said dielectric sidewall extending downward from a topside surface of said p-epi layer to said NBL, said DEEPN ring enclosing a portion of said p-epi layer to define an enclosed p-epi region within, and a plurality of inner DT structures within said enclosed p-epi region each comprising at least a dielectric sidewalls having said DEEPN diffusion contacting said dielectric sidewalls and extending downward from said topside surface to said NBL, wherein said plurality of inner DT structures have a sufficiently small inner DT structure spacing so that adjacent ones of said DEEPN diffusion regions overlap to form continuous wall of n-type material which extends from a first side to a second side of said outer DT ring to divide said enclosed p-epi region into a first p-epi region and a second p-epi region, wherein said NBL in said first p-epi region connects to said NBL in said second p-epi region.
地址 Dallas TX US