| 发明名称 |
CURING AGENTS FOR LOW-EMISSION EXPOXY RESIN PRODUCTS |
| 摘要 |
The present invention relates to curing agents for epoxy resins, containing at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one secondary diamine which is free of primary amino groups and free of hydroxyl groups. The curing agent is of low viscosity and cures, together with epoxy resins, rapidly and without blushing, even under damp, cold conditions, to form films of high hardness and low brittleness. It is particularly well suited for low-emission coatings that cure at room temperature. |
| 申请公布号 |
US2015337076(A1) |
申请公布日期 |
2015.11.26 |
| 申请号 |
US201314759538 |
申请日期 |
2013.12.20 |
| 申请人 |
SIKA TECHNOLOGY AG |
发明人 |
KASEMI Edis;KRAMER Andreas;STADELMANN Ursula;BURCKHARDT Urs |
| 分类号 |
C08G59/56;C08G59/22 |
主分类号 |
C08G59/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A curing agent, suitable for curing epoxy resins, comprising:
at least one adduct of at least one primary diamine P1 and at least one aromatic monoepoxide; at least one primary diamine P2; and at least one secondary diamine, which is free of primary amino groups and free of hydroxyl groups, and which is not 1,3-bis(benzylaminomethyl)benzene. |
| 地址 |
Baar CH |
