SYSTEM AND METHOD FOR THERMALLY COUPLING MEMORY DEVICES TO A MEMORY CONTROLLER IN A COMPUTER MEMORY BOARD

摘要

A system and method for thermally coupling memory devices, such as DIMM memory modules, to an associated memory controller such that both are cooled together at the same relative temperature. By maintaining all of the devices at a much more uniform temperature, memory timing issues are effectively eliminated. In accordance with an exemplary embodiment, the controller chip is physically located between two or more banks of memory, and is positioned under an adjoining heat sink while the memory DIMMs are positioned laterally of the controller chip in angled DIMM slots and are coupled to the controller chip with respective heat spreaders.

主权项

1. A computer system comprising at least one memory board, said memory board comprising:
a circuit board, said circuit board comprising at least one bank of memory devices and an associated memory controller; a heat sink adjoining said memory controller; a heat spreader adjoining said at least one bank of memory devices; and a device for thermally coupling said heat sink to said heat spreader.