Vacuum Pallet Reflow

摘要

A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

主权项

1. A system for manufacturing printed circuit boards, comprising:
an oven configured to elevate a temperature therein; a portable solder pallet assembly configured to be selectively inserted into said oven, said portable solder pallet assembly comprising: a portable vacuum solder pallet defining a selectively sealable solder chamber configured to temporarily mount a printed circuit board therein; wherein said solder chamber is configured to be selectively fluidly connected to a source of negative pressure relative to a pressure in said solder chamber.