| 摘要 |
The present disclosure is directed to a circuit board having a first polyimide coverlay and a second polyimide coverlay derived from 80 to 90 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine or 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4′-oxydianiline, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply having a polyimide derived from 80 to 90 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer, a fourth imaged metal layer. |
| 主权项 |
1. A circuit board, comprising in the following order:
a. a first polyimide coverlay comprising a polyimide derived from
i) 80 to 90 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine; orii) 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4′-oxydianiline; b. a first imaged metal layer; c. a first electrically insulating layer having a first side and a second side; the first side of the first electrically insulating layer is next to the first imaged metal layer; d. a second imaged metal layer; the second side of the first electrically insulating layer is next to the second imaged metal layer; e. a polyimide bondply comprising a polyimide derived from 80 to 90 mole 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine; f. a third imaged metal layer; g. a second electrically insulating layer having a first side and a second side; the first side of the second electrically insulating layer is next to the third imaged metal layer; h. a fourth imaged metal layer; the second side of the second electrically insulating layer is next to the fourth imaged metal layer; and i. a second polyimide coverlay comprising a polyimide derived from
i) 80 to 90 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine; orii) 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4′-oxydianiline;wherein the polyimide bondply is in direct contact with the second imaged metal layer and exposed areas of the second side of the first electrically insulating layer; and in direct contact with the third imaged metal layer and exposed areas of the first side of the second electrically insulating layer;wherein the polyimide bondply has a peel strength from 0.7 to 2 N/mm as measured in accordance with IPC-TM-650-2.4.9d, when
i) the first imaged metal layer, the first electrically insulating layer and the second imaged metal layer; ii) the polyimide bondply; and iii) the third imaged metal layer, the second electrically insulating layer and the fourth imaged metal layer are laminated at a lamination temperature of 340° C. or greater and a pressure from 150 psi (10.55 Kg/cm) to 400 psi (28.13 Kg/cm);wherein the first polyimide coverlay is in direct contact with the first imaged metal layer and exposed areas of the first side of the first electrically insulating layer; wherein the second polyimide coverlay is in direct contact with the fourth imaged metal layer and exposed areas of the second side of the second electrically insulating layer; and wherein the first electrically insulating layer and the second electrically insulating layer are any electrically insulating material that can withstand the lamination temperature of 350° C. or greater. |
