发明名称 POLYAMIDE RESIN COMPOSITION FOR MOLDED ARTICLE CONTACTING HIGH-PRESSURE HYDROGEN AND MOLDED ARTICLE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition capable of providing a molded article having suppressed generation of defect points even with repeated filling and pressure release of high-pressure hydrogen.SOLUTION: There is provided a polyamide resin composition for a molded article contacting high-pressure hydrogen by blending a polyamide resin (A) and a layer silicate (B).
申请公布号 JP2015212343(A) 申请公布日期 2015.11.26
申请号 JP20140095779 申请日期 2014.05.07
申请人 TORAY IND INC 发明人 OCHIAI SHINICHIRO;SATO DAISUKE;KOBAYASHI SADAYUKI
分类号 C08L77/00;C08K7/00;F17C5/06 主分类号 C08L77/00
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