This circuit board comprises: a heat storage body; an insulating layer that is arranged on the heat storage body; a wiring board that is arranged on the insulating layer; and a heat generation component that is arranged on the wiring board. The insulating layer is arranged independently from the wiring board. The wiring board is provided with a heat-transmitting metal part that penetrates the wiring board and faces the heat generation component. The insulating layer is provided with a heat-transmitting resin part that penetrates the insulating layer and faces the heat-transmitting metal part. The heat-transmitting resin part and a part of the insulating layer intervene between the heat-transmitting metal part and the heat storage body.
