A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.
申请公布号
WO2015178970(A1)
申请公布日期
2015.11.26
申请号
WO2015US14599
申请日期
2015.02.05
申请人
SIERRA CIRCUITS, INC.
发明人
KARAVAKIS, KONSTANTINE;BAHL, KENNETH, S.;CARNEY, STEVE