发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a semiconductor device includes forming two isolation structures in a substrate to define a fin structure between the two isolation structures in the substrate. A dummy gate and spacers are formed bridging the two isolation structures and over the fin structure. The two isolation structures are etched with the dummy gate and the spacers as a mask to form a plurality of slopes under the spacers in the two isolation structures. A gate etch stop layer is formed overlying the plurality of slopes. The dummy gate and the two isolation structures beneath the dummy gate are removed to create a cavity confined by the spacers and the gate etch stop layer. A gate is then formed in the cavity.
申请公布号 US2015340475(A1) 申请公布日期 2015.11.26
申请号 US201514819654 申请日期 2015.08.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN Chien-Chih;HONG Long-Jie;WANG Chih-Lin;CHANG Chia-Der
分类号 H01L29/66;H01L29/06;H01L21/3105;H01L21/311 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method for manufacturing a semiconductor device, the method comprising: forming two isolation structures in a substrate to define a fin structure between the two isolation structures in the substrate; forming a dummy gate and spacers bridging the two isolation structures and over the fin structure; etching the two isolation structures with the dummy gate and the spacers as a mask to form a plurality of slopes under the spacers in the two isolation structures; forming a gate etch stop layer overlying the plurality of slopes; removing the dummy gate and the two isolation structures beneath the dummy gate to create a cavity confined by the spacers and the gate etch stop layer; and forming a gate in the cavity.
地址 HSINCHU TW