| 发明名称 |
EMBEDDED PACKAGE SUBSTRATE CAPACITOR |
| 摘要 |
A package substrate is provided that includes a core substrate and a capacitor embedded in the core substrate including a first side. The capacitor includes a first electrode and a second electrode disposed at opposite ends of the capacitor. The package also includes a first power supply metal plate extending laterally in the core substrate. The first power supply metal plate is disposed directly on the first electrode of the capacitor from the first side of the core substrate. A first via extending perpendicular to the first metal plate and connected to the first power supply metal plate from the first side of the core substrate. |
| 申请公布号 |
US2015340425(A1) |
申请公布日期 |
2015.11.26 |
| 申请号 |
US201414283980 |
申请日期 |
2014.05.21 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
We Hong Bok;Hwang Kyu-Pyung;Song Young Kyu;Kim Dong Wook |
| 分类号 |
H01L49/02;H05K1/18;H05K3/46;H01L23/498 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package substrate, comprising:
a substrate comprising a first side; a capacitor embedded in the substrate, the capacitor comprises a first electrode and a second electrode; a first metal plate extending laterally in the substrate, wherein the first metal plate is disposed directly on the first electrode of the capacitor from a first side of the substrate; and a first via extending perpendicular to the first metal plate and connected to the first metal plate from the first side of the substrate. |
| 地址 |
San Diego CA US |
