发明名称 CONTACT COMPONENT AND SEMICONDUCTOR MODULE
摘要 A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.
申请公布号 US2015340333(A1) 申请公布日期 2015.11.26
申请号 US201514817894 申请日期 2015.08.04
申请人 FUJI ELECTRIC CO., LTD. 发明人 ISOZAKI Makoto
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module, the contact component comprising: a cylindrical portion having a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion, and having a diameter larger than an external diameter of the cylindrical portion, wherein an end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange, wherein the cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.
地址 Kawasaki-shi JP