主权项 |
1. A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module, the contact component comprising:
a cylindrical portion having a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion, and having a diameter larger than an external diameter of the cylindrical portion, wherein an end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange, wherein the cylindrical portion includes a cut-out portion at an inner side of a lower end thereof. |