MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND COMPUTING SYSTEM CONTAINING SAME

摘要

A microelectronic package comprises a die (110, 210) and a plurality of electrically conductive layers (120, 220) and electrically insulating layers (130, 230), including a first electrically insulating layer (131, 231) closer to the die than any other electrically insulating layer) and second (132, 232) and third electrically insulating layers (233). Each electrically insulating layer has a corresponding glass transition temperature, coefficient of thermal expansion, and modulus of elasticity. The modulus of elasticity of the second electrically insulating layer is greater than that for the first electrically insulating layer, while CTE1 for the second electrically insulating layer is greater than CTE1 for the first. CTE2 for the third electrically insulating layer is less than CTE2 for the first electrically insulating layer. In an embodiment an electrically insulating layer is a glass cloth layer (140) that is an outermost layer of the microelectronic package.

主权项

1. A microelectronic package comprising:
a microelectronic die; a plurality of electrically conductive layers; a plurality of electrically insulating layers including:
a first electrically insulating layer closer to the die than any other electrically insulating layer; anda second electrically insulating layer; and a first glass cloth layer comprising a plurality of glass fibers encapsulated in a dielectric material, the first glass cloth layer constituting an outermost layer of the microelectronic package.