COATING PROCESSING APPARATUS

摘要

At the time of initiating coating, when a first end of an ejecting port of a coating nozzle is located at one end of a peripheral edge of a wafer, the wafer and the coating nozzle are relatively moved by a moving mechanism while exposing a coating liquid from the ejecting port. During the coating, the wafer and the coating nozzle are relatively moved by the moving mechanism while the coating liquid ejected from the ejecting port is in contact with the wafer, to coat the coating liquid on the wafer. At the time of finishing the coating, when a second end of the ejecting port is located at the other end of the peripheral edge of the wafer, the wafer and the coating nozzle are relatively moved by the moving mechanism while exposing the coating liquid from the ejecting port.

主权项

1. A coating processing apparatus for coating a coating liquid on a substrate, the coating processing apparatus comprising:
a coating nozzle configured to eject the coating liquid to the substrate from a slit-shaped ejecting port; a moving mechanism configured to relatively move the substrate and the coating nozzle in a direction perpendicular to a longitudinal direction of the ejecting port; and a control unit configured to control the coating nozzle and the moving mechanism, wherein the control unit controls the coating nozzle and the moving mechanism to execute: an initiating step of relatively moving the substrate and the coating nozzle by the moving mechanism while exposing the coating liquid from the ejecting port when a first end of the ejecting port at the substrate side is located at one end of a peripheral edge of the substrate, a coating step of coating the coating liquid on the substrate by relatively moving the substrate and the coating nozzle in a horizontal direction by the moving mechanism while bringing the coating liquid ejected from the ejecting port into contact with the substrate, and a finishing step of relatively moving the substrate and the coating nozzle by the moving mechanism while exposing the coating liquid from the ejecting port when a second end of the ejecting port opposite to the first end is located at the other end of the peripheral edge of the substrate.