| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging element which suppresses an increase in cost due to an increase in chip area of a peripheral circuit without damaging performance of a pixel section.SOLUTION: An imaging element includes: first and second semiconductor substrates; a pixel section where a plurality of pixels 201 are arranged in matrix; a plurality of column signal lines 208 where signals are outputted for each colum from the plurality of pixels of the pixel section; and a plurality of column circuits 103 which are connected to the column signal lines 208 and perform prescribed processing on the signals outputted to the column signal lines. The pixel section 101 is formed in a region 1 of the first semiconductor substrate and the plurality of column circuits 103 are formed in a region 2 of the second semiconductor substrate. The plurality of column circuits 103 are arranged at different positions in at least two adjacent columns in at least one direction between a direction following a row and a direction following the column. |
