发明名称 |
IMAGE SENSOR PACKAGE |
摘要 |
Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween. |
申请公布号 |
US2015340397(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
US201514606010 |
申请日期 |
2015.01.26 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
SEO Byoung-rim;CHOI Yoon-young;CHOI Kyoung-sei;JIN Chang-soo;MOK Seung-kon;SUH Tae-weon;KIM Pyoung-wan |
分类号 |
H01L27/146;H01L31/0203 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. An image sensor package comprising:
a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in a vicinity of the sensor array region; a plurality of microlenses formed on the plurality of unit pixels, respectively; at least two transparent material layers covering the plurality of microlenses; and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween. |
地址 |
Suwon-si KR |