发明名称 IMAGE SENSOR PACKAGE
摘要 Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.
申请公布号 US2015340397(A1) 申请公布日期 2015.11.26
申请号 US201514606010 申请日期 2015.01.26
申请人 Samsung Electronics Co., Ltd. 发明人 SEO Byoung-rim;CHOI Yoon-young;CHOI Kyoung-sei;JIN Chang-soo;MOK Seung-kon;SUH Tae-weon;KIM Pyoung-wan
分类号 H01L27/146;H01L31/0203 主分类号 H01L27/146
代理机构 代理人
主权项 1. An image sensor package comprising: a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in a vicinity of the sensor array region; a plurality of microlenses formed on the plurality of unit pixels, respectively; at least two transparent material layers covering the plurality of microlenses; and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.
地址 Suwon-si KR