HEAT DISSIPATING BONDING PAD AND PRINTED CIRCUIT BOARD

摘要

Disclosed are a heat dissipating bonding pad and a printed circuit board. A surface of the heat dissipating bonding pad for the arrangement of electronic elements comprises an upper solder area and a non-upper solder area, the upper solder area is used for coating a solder, and the non-upper solder area comprises heat collection channels and heat dissipation channels. The heat collection channels are used for collecting heat on the heat dissipating bonding pad. The heat dissipation channels are communicated with the heat collection channels, and the openings of the heat dissipation channels are located on the edge of the heat dissipating bonding pad, in order to discharge the heat collected by the heat collection channels to the outside of the heat dissipating bonding pad. The heat dissipating bonding pad the allows most of the heat thereon to be dissipated into the heat collection channels, and to the outside of the heat dissipating bonding pad through the heat dissipation channels; and the speed at which the heat is dissipated along the heat collection channels and the heat dissipation channels is higher than the speed at which the heat is dissipated towards the edge of the heat dissipating bonding pad along the upper solder area, so that the the heat dissipating bonding pad has a higher heat dissipation speed.