摘要 |
The present invention relates to a connecting tape for connecting a carrier band for SMD. More particularly, the present invention provides a complex connecting tape for a carrier band capable of easily sensing a connection section of the connecting tape by using light or a magnetic field by forming a first tape with a metal material which is sensed, forming a second tape with a non-transmission material, punching a first point hole on an adhesive sheet to coincide with a sprocket hole, and forming a fold line which is cut with a dotted line in parallel to the point hole. |