发明名称 HEAT RELEASE SHEET OF HIGH THERMAL CONDUCTIVITY AND PRODUCTION METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a heat release sheet which can efficiently release heat generated from e.g. electronic parts in small electronic apparatuses externally and is inexpensive.SOLUTION: A heat release sheet has a structure in which carbon black is dispersed uniformly among graphite fine particles, and the mass ratio of the graphite fine particle/carbon black is 75/25 to 95/5. The carbon black consists of channel black, Ketjenblack and/or acetylene black. The heat release sheet has a density of 2.0 g/cmor higher and a thermal conductivity of 580 W/mK or higher in the in-plane direction and is obtained by repeating twice or more a step of applying an organic solvent dispersion of the graphite fine particle/carbon black/organic binder to one surface of a die and drying to form a resin-containing composite sheet, baking the resin-containing composite sheet to remove the organic binder and compacting the resultant graphite fine particle/carbon black composite sheet with a press.
申请公布号 JP2015212211(A) 申请公布日期 2015.11.26
申请号 JP20140095419 申请日期 2014.05.02
申请人 KAGAWA SEIJI 发明人 KAGAWA SEIJI
分类号 C01B31/04;B32B9/00;H01L23/36;H01L23/373;H05K7/20 主分类号 C01B31/04
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