| 发明名称 |
PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME |
| 摘要 |
A printed circuit board connected to one surface of a substrate and a first electronic component is mounted on the one surface. The printed circuit board includes at least one insulating layer and the insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material. |
| 申请公布号 |
US2015342046(A1) |
申请公布日期 |
2015.11.26 |
| 申请号 |
US201514719309 |
申请日期 |
2015.05.21 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Hye Jin;JUNG Hye Won;KANG Myung Sam;BONG Kang Wook;KO Young Gwan;SEONG Min Jae |
| 分类号 |
H05K1/11;C25D5/02;H05K3/06;H05K3/00;H05K1/18;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board connected to one surface of a substrate having a first electronic component mounted on the one surface and including at least one insulating layer, wherein
the at least one insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material. |
| 地址 |
Suwon-Si KR |
