| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting heat-dissipating insulating adhesive composition which has heat dissipation properties and electrical insulation properties and exhibits sufficient adhesive strength when cured.SOLUTION: The heat-dissipating insulating adhesive composition contains a polyurethane resin composition (A), a thermally conductive filler (B), and a thermal polymerization initiator (C). The polyurethane resin composition (A) contains: a polyurethane (a) having a (meth)acryloyl group and a polyoxyalkylene skeleton; and a polymerizable monomer (b) containing (meth)acrylic acid and/or &bgr;-carboxyethyl (meth)acrylate, and a polyfunctional (meth)acrylate. The content of the inorganic filler (B) is 250-700 pts.mass based on 100 pts.mass of the polyurethane resin composition (A). |
