发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a hot-melt adhesive composition having re-peelable and appropriate adhesiveness at normal temperature and firmly bonding by conducting a relaxing heat treatment after lamination.SOLUTION: There is provided a hot-melt adhesive composition containing (i) an olefin copolymer (I) which is a copolymer of a specific olefin monomer and a specific polar monomer and (ii) an acrylic block copolymer (II) having at least one polymer block (A) consisting of a methacrylic acid ester unit and at least one polymer block (B) consisting of an acrylic acid ester unit and having a mass ratio of the olefin polymer (I):the acrylic block copolymer (II) of 80:20 to 51:49.
申请公布号 JP2015212316(A) 申请公布日期 2015.11.26
申请号 JP20140094529 申请日期 2014.05.01
申请人 KURARAY CO LTD 发明人 MORISHITA YOSHIHIRO;KANEMURA HIDEAKI
分类号 C09J123/00;C09J7/00;C09J11/08;C09J153/00 主分类号 C09J123/00
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