发明名称 |
HOT-MELT ADHESIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a hot-melt adhesive composition having re-peelable and appropriate adhesiveness at normal temperature and firmly bonding by conducting a relaxing heat treatment after lamination.SOLUTION: There is provided a hot-melt adhesive composition containing (i) an olefin copolymer (I) which is a copolymer of a specific olefin monomer and a specific polar monomer and (ii) an acrylic block copolymer (II) having at least one polymer block (A) consisting of a methacrylic acid ester unit and at least one polymer block (B) consisting of an acrylic acid ester unit and having a mass ratio of the olefin polymer (I):the acrylic block copolymer (II) of 80:20 to 51:49. |
申请公布号 |
JP2015212316(A) |
申请公布日期 |
2015.11.26 |
申请号 |
JP20140094529 |
申请日期 |
2014.05.01 |
申请人 |
KURARAY CO LTD |
发明人 |
MORISHITA YOSHIHIRO;KANEMURA HIDEAKI |
分类号 |
C09J123/00;C09J7/00;C09J11/08;C09J153/00 |
主分类号 |
C09J123/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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