发明名称 METHOD FOR MANUFACTURING METALLIC REFLECTOR FOR LED PACKAGE
摘要 A metallic reflector manufacturing method for an LED package. The method includes preparing a metal plate, and processing a stamping reflector that includes a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body. A reflection surface that is slanted by a predetermined angle is formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside. A fixation portion is formed to fix the lower body on a substrate that the LED chip is mounted on. The method further includes sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface. The stamping processing includes a piercing step, a drawing step, a first noting step, a half etching step that forms the fixation portion, and a second notching step.
申请公布号 US2015340545(A1) 申请公布日期 2015.11.26
申请号 US201514716313 申请日期 2015.05.19
申请人 KIM Jeong Tae;NEOVIT CO., LTD. 发明人 KIM Yung Cheon;NAM Deok Hee;PARK Min Chul;PARK Hae Chul;KANG Baek Won
分类号 H01L33/00;H01L33/60 主分类号 H01L33/00
代理机构 代理人
主权项 1. A metallic reflector manufacturing method that a reflection surface is formed to surround an LED chip that is disposed on a substrate at a predetermined height and has a predetermined slant angle to reflect the light of the LED chip to the outside, comprising: (a) preparing a metal plate; (b) processing a stamping reflector that includes a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body, a reflection surface that is slanted by a predetermined angle is formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside, and is processed by a stamping process such that a fixation portion is formed to fix the lower body on a substrate that the LED chip is mounted on; (c) sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface; wherein the stamping processing of the step (b), comprising: (b-1) a piercing step that pierces a base hole for each stage of the stamping process at an upper and lower edge of the metal plate in a length direction of the metal plate; (b-2) a drawing step that forming the reflection surface on the metal plate between the base holes; (b-3) a first noting step that eliminates a scrap from the metal plate; (b-4) a half etching step that forms the fixation portion; (b-5) a second notching step that forms the opening.
地址 Bucheon-si KR