发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
An object is to provide a method for manufacturing a highly reliable semiconductor device which includes a thin film transistor using an oxide semiconductor and having stable electric characteristics. In manufacture of a semiconductor device in which an oxide semiconductor is used for a channel formation region, after an oxide semiconductor film is formed, a conductive film including a metal, a metal compound, or an alloy that can absorb or adsorb moisture, a hydroxy group, or hydrogen is formed to overlap with the oxide semiconductor film with an insulating film provided therebetween. Then, heat treatment is performed in the state where the conductive film is exposed; in such a manner, activation treatment for removing moisture, oxygen, hydrogen, or the like adsorbed onto a surface of or in the conductive film is performed. |
申请公布号 |
US2015340508(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
US201514816112 |
申请日期 |
2015.08.03 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
AKIMOTO Kengo |
分类号 |
H01L29/786;H01L29/423;H01L29/417 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a gate electrode on an insulating surface; a gate insulating film over the gate electrode; an oxide semiconductor film over the gate insulating film; a source electrode and a drain electrode over the oxide semiconductor film; an insulating film over the oxide semiconductor film, the source electrode, and the drain electrode and in contact with the oxide semiconductor film; and a back gate electrode over the insulating film and overlapping with the gate electrode and the oxide semiconductor film, wherein the back gate electrode includes a hydrogen absorbing alloy. |
地址 |
Atsugi-shi JP |