CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS

摘要

A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

主权项

1. A method of making a frame lid assembly comprising:
providing a plate with a top surface, a bottom surface opposite the top surface and a sidewall that joins the top and bottom surface together, providing a solder preform, applying a mask to the top surface of the plate over a central area of the top surface of the plate and define a peripheral area on the top surface, forming a seal ring by metallizing the peripheral area and the sidewall of the plate, attaching the solder preform to the seal ring, and removing the mask to obtain the frame lid.