发明名称 CHIP ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THEREOF
摘要 A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.
申请公布号 US2015340149(A1) 申请公布日期 2015.11.26
申请号 US201414541552 申请日期 2014.11.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE Dong Hwan;YOON Chan;CHA Hye Yeon;HAN Jin Woo
分类号 H01F27/28;H05K1/11;H01F27/29;H05K1/18;H01F27/24 主分类号 H01F27/28
代理机构 代理人
主权项 1. A chip electronic component comprising: a magnetic material body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, the coil conductor comprising a plurality of loops/sections, the plurality of loops/sections including an innermost loop/section and remaining loops/sections; and external electrodes disposed on external portions of the magnetic material body to be connected to end portions of the coil conductor patterns, wherein in a cross section of the magnetic material body in a length direction, a thickness of the innermost loop/section is smaller than a thickness of at least one of the remaining loops/sections of the coil conductor patterns.
地址 Suwon-Si KR