Optoelektronisches Halbleiterbauteil und Verfahren zu seiner Herstellung

摘要

An optoelectronic semiconductor component (500) comprises an optoelectronic semiconductor chip (600) with a first surface (601) and a second surface (602), in addition to a protective chip which has a protective diode (700), a first surface (701) and a second surface (702). The semiconductor chip and the protective chip are embedded in a moulded body (800). A first electrical contact (610) and a second electrical contact (620) are arranged on the first surface of the semiconductor chip. A third electrical contact (710) and a fourth electrical contact (720) are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.