RESIN COMPOSITION FOR SEAL, SEMICONDUCTOR DEVICE, AND STRUCTURE

摘要

PROBLEM TO BE SOLVED: To suppress the warp of a semiconductor device.SOLUTION: A resin composition for seal comprises a thermosetting resin, and satisfies the following conditions (A) and (B). (A) The shrinkage ratio Sis 0.7% or more when the resin composition is subjected to a thermal treatment at 175°C for 3 minutes; and (B) the 260°C-bend elastic constant Eof a set material obtained by performing a thermal treatment at 175°C for 4 hours after the thermal treatment at 175°C for 3 minutes is 0.5 GPa or larger.