发明名称 |
Integrated Wiring System for Composite Structures |
摘要 |
A method for manufacturing a composite part. Layers of composite material are cured to form the composite part. A primer is depicted on a surface of the composite part. A group of conductive elements is deposited on the primer to form an electronic device on the primer. |
申请公布号 |
US2015342077(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
US201414282248 |
申请日期 |
2014.05.20 |
申请人 |
The Boeing Company |
发明人 |
Dalal Hardik;Duce Jeffrey Lynn;Rosillo Yelina;Robbins Brent A.;Merriweather Breana K. |
分类号 |
H05K7/06;C23C4/08;C23C4/00;C23C4/12 |
主分类号 |
H05K7/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing a composite part comprising:
curing layers of composite material to form the composite part; depositing a primer on a surface of the composite part; and depositing a group of conductive elements on the primer such that an electronic device is formed on the composite part. |
地址 |
Chicago IL US |