发明名称 HOUSING ARRANGEMENT OF A POWER ELECTRONICS DEVICE
摘要 A housing arrangement of a power electronics device, including one power module or several identical power modules, each module with at least one part connected to a hazardous voltage, the arrangement further including a housing part having room for at least one power module. Each power module includes an enclosure part which essentially surrounds the power module and includes electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part. The power modules and the enclosure part of the power modules are arranged such that when the power module is installed to the housing part the power module is electrically insulated from the housing part and external connections of the power module are directed to the front side of the housing part.
申请公布号 US2015342076(A1) 申请公布日期 2015.11.26
申请号 US201514707469 申请日期 2015.05.08
申请人 VACON OYJ 发明人 DILLEY Devin;HOFFMAN Marc;ISAKSSON Dan
分类号 H05K7/02;H05K7/10;H02M7/00;H05K7/06 主分类号 H05K7/02
代理机构 代理人
主权项 1. A housing arrangement of a power electronics device, comprising one power module or several identical power modules, each module having at least one part connectable to a hazardous voltage, the arrangement further comprising a housing part having room for at least one power module, wherein each power module comprises an enclosure part which essentially surrounds the power module and comprises electrically insulating material, and all the external connections of the power module are placed on one single wall of the enclosure part, and the external connections of the power module are directed to the front side of the housing part.
地址 VAASA FI