| 主权项 |
1. An integrated magnetic device, comprising:
a conventionally formed silicon wafer, having a substrate, an active region comprising transistors, diodes, capacitors and resistors coupled by a conductive interconnect layer, to form an active circuit, wherein the active region touches the top surface of the silicon wafer substrate and includes a first plurality of bond contacts; wherein the conductive interconnect layer is comprised of multiple layers of conductive material with insulating layers therebetween, the multiple layers of conductive material coupled together by a first plurality of vias piercing their associated insulating layer, wherein the top of the conductive interconnect layer is an insulating layer, having openings to expose a first plurality of bond contacts; also wherein the insulating layer on top of the conductive interconnect layer is covered by a Silicon Nitride layer, having openings to expose the first plurality of bond contacts; a first layer of polymer, having a first plurality of openings extending from the top surface of the first polymer layer down to the plurality of bond contacts, wherein the first plurality of openings are filled with a high conductance material forming a second plurality of vias coupled to the first plurality of bond contacts; a first layer of high conductance material filling the first plurality of openings and the overlaying and touching the surface of the first polymer layer, wherein the first layer of high conductance material is defined and configured to include a plurality of rectangular bottom coil members and a coupling means to connect to the second plurality of vias and coupling to the first plurality of bond contacts; the plurality of rectangular bottom coil members, composed of the first layer of high conductance material, overlaying and touching the first layer of polymer, each bottom coil member including, a second plurality of bond contacts at the ends of each of the bottom coil members, one of each of a plurality of bottom slots therein, wherein each of the bottom slots pierces its respective bottom coil member; a second layer of polymer, touching the first layer of polymer and the first layer high conductance material wherein the top surface of the second layer of polymer is planar, the second layer of polymer including a second plurality of openings extending from the top surface of the second layer of polymer down to the second plurality of contacts, wherein the openings in the second layer of polymer are filled with a third plurality of vias; a layer of titanium touching the second layer of polymer and the tops of the third plurality of vias; a magnetic core selected from a single layer of magnetic core material or a laminated magnetic core material deposited and defined on the top surface of second layer of polymer, wherein the magnetic core, as defined, does not touch the third plurality of vias exposed on the top surface of the second layer of polymer; a third layer of polymer touching the second layer of polymer and the top of the magnetic core material, wherein the third layer of polymer includes a third plurality of openings extending from the top surface of the third layer of polymer down to the top surfaces of the third plurality of vias, wherein the openings in the third layer of polymer are filled with a fourth plurality of vias; a second layer of high conductance material filling the third plurality of openings and overlaying and touching the surface of the third polymer layer, wherein the second layer of high conductance material is defined and configured to include a plurality of rectangular top coil members and coupling to the third plurality of vias; the plurality of rectangular top coil members, composed of the second layer of high conductance material, overlaying and touching the third layer of polymer, each top coil member including, a third plurality of bond contacts at the ends of each of the top coil members, wherein each one of the third plurality of bond contacts touching and coupling to one each of the fourth plurality of vias, and of a plurality of top slots therein, wherein each of the top slots pierces its respective top coil member; and a fourth layer of polymer touching the third layer of polymer and the top of the second layer high conductance material, wherein the fourth layer of polymer includes a fourth plurality of openings extending from the top surface of the fourth lay of polymer down to the top surfaces second layer high conductance material, the openings in the fourth layer of polymer are filled with solder balls, wherein the solder balls provide connection to outside circuitry. |
