| 发明名称 |
BONDING ALIGNMENT TOOL |
| 摘要 |
An apparatus includes a bonding system configured to bond at least two wafers. The bonding system has a flag-out mechanism configured to remove a plurality of flags from an area between the at least two wafers. The apparatus also includes sensors configured to detect data related to a flag-out condition of the flags of the plurality of flag. The apparatus further includes at least one processor configured to receive inputs from the sensors, to calculate at least one value related to flag-out timing, and to drive a display indicating an alignment of the at least two wafers. |
| 申请公布号 |
US2015340337(A1) |
申请公布日期 |
2015.11.26 |
| 申请号 |
US201514819552 |
申请日期 |
2015.08.06 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SHIH Yun-Tai;PAN Kuan-Ming;LIN Jeng-Hao;WANG I-Shi;CHO Jui-Mu;SU Ching-Hou;NI Chyi-Tsong;TSAI Wun-Kai |
| 分类号 |
H01L23/00;H01L23/544;H01L21/68 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a bonding system configured to bond at least two wafers, the bonding system having a flag-out mechanism configured to remove a plurality of flags from an area between the at least two wafers; sensors configured to detect data related to a flag-out condition of the flags of the plurality of flags; and at least one processor configured to receive inputs from the sensors, to calculate at least one value related to flag-out timing, and to drive a display indicating an alignment of the at least two wafers. |
| 地址 |
Hsinchu TW |
