A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
申请公布号
US2015340331(A1)
申请公布日期
2015.11.26
申请号
US201514818922
申请日期
2015.08.05
申请人
Hewlett-Packard Development Company, L.P.
发明人
White Lawrence H.;Vina Robert;Mcmahon Terry;Przybyla James R.