发明名称 METHODS OF FABRICATING SELF-ALIGNED METAL LAYER STRUCTURE AND OPTIC
摘要 A method of fabricating a self-aligned metal layer structure is disclosed. The method includes: providing a substrate including a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is directly transferred in the electroplated metal layer in a self-aligned manner. Methods of fabricating optics are also disclosed. The methods are capable of high accuracy in alignment, and the optics can be used in the production of a lens module.
申请公布号 US2015337449(A1) 申请公布日期 2015.11.26
申请号 US201414449059 申请日期 2014.07.31
申请人 OmniVision Optoelectronics Technologies (Shanghai) Co., Ltd. 发明人 Chung Chia-Ming;Lin Chien-Pang
分类号 C25D5/34;C25D9/04;C25D7/00 主分类号 C25D5/34
代理机构 代理人
主权项 1. A method of fabricating a self-aligned metal layer structure, the method comprising the following steps in the sequence set forth: providing a substrate comprising a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is transferred in the electroplated metal layer.
地址 Shanghai CN