发明名称 |
METHODS OF FABRICATING SELF-ALIGNED METAL LAYER STRUCTURE AND OPTIC |
摘要 |
A method of fabricating a self-aligned metal layer structure is disclosed. The method includes: providing a substrate including a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is directly transferred in the electroplated metal layer in a self-aligned manner. Methods of fabricating optics are also disclosed. The methods are capable of high accuracy in alignment, and the optics can be used in the production of a lens module. |
申请公布号 |
US2015337449(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
US201414449059 |
申请日期 |
2014.07.31 |
申请人 |
OmniVision Optoelectronics Technologies (Shanghai) Co., Ltd. |
发明人 |
Chung Chia-Ming;Lin Chien-Pang |
分类号 |
C25D5/34;C25D9/04;C25D7/00 |
主分类号 |
C25D5/34 |
代理机构 |
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代理人 |
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主权项 |
1. A method of fabricating a self-aligned metal layer structure, the method comprising the following steps in the sequence set forth:
providing a substrate comprising a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is transferred in the electroplated metal layer. |
地址 |
Shanghai CN |