主权项 |
1. A substrate structure, comprising:
a substrate, comprising a first through hole, a first surface, and a second surface opposite to the first surface, wherein the first through hole penetrates the substrate for connecting the first surface and the second surface; and a carrier, comprising a second through hole, a release layer, an insulating paste layer, and a metal layer, wherein the insulating paste layer is disposed between the release layer and the metal layer, the carrier is attached to the second surface by attaching the release layer to the second surface, and the second through hole corresponds to the first through hole and penetrates the carrier for exposing the first through hole. |