WAFER LEVEL PACKAGING DEVICE FOR CONTROLLING FIELD OF VIEW

摘要

Provided is a wafer level packaging device for controlling a field of view. The packaging device of the present invention includes a lower sensor substrate having a sensor; an upper cap substrate which is provided on the lower sensor substrate and has a cavity on a side thereof to accommodate the sensor; a metal solder layer which bonds the lower sensor substrate to the upper cap substrate; and an IR blocking layer which is formed on the upper end part of the upper cap substrate.