| 摘要 |
The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag2O, V2O5, and TeO2, and in which the total content of Ag2O, V2O5, and TeO2 is 75 mass % or more; and a resin composition having a 5% thermal weight reduction temperature equal to or greater than a softening point temperature of the low-melting-point glass composition. |
