| 摘要 |
The invention relates to multilayer inductive components, which can be embedded in low temperature co-fired ceramics (LTCC), and a multilayer circuit board structure (10) which enables the production of the embedded components by means of co-firing. A dielectric cover (5) is disclosed which is created either from the material of the circuit carrier or from a dielectric material compatible with the material of the circuit carrier, which can advantageously influence miniaturization of components by embedding passive components (2, 3) of this type into the circuit board and by providing the surfaces obtained for population with additional components. The cover is laminated onto the magnetic ceramic layer (3) for this purpose. In monolithic ceramic construction, the multilayer dielectric (1, 4, 5) and magnetic circuit board parts (3) are mechanically uncoupled by pre-sintering the ferrite and an adapted cavity (6), so that sintering in the composite is possible even when using non-adapted materials. |
