| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which achieves less contamination of a semiconductor chip and improved manufacturing efficiency.SOLUTION: A semiconductor device manufacturing method comprises: a process A of preparing a semiconductor chip; a process B of preparing a resin sheet having a thermoset resin layer; and a process D of embedding the semiconductor chip in the thermoset resin layer. The semiconductor ship has a circuit formation surface; and a conduction composition is formed on the circuit formation surface; and the process D is a process of embedding the semiconductor chip in a state where the thermoset resin layer of the resin sheet and the circuit formation surface of the semiconductor chip are opposed to each other. In addition, processes following the process D includes a process of exposing the conduction component and a process of forming on the thermoset resin layer, rewiring connected to the exposed conduction component. |
