| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a semiconductor element, a substrate, a lead, and a sealing resin member. The semiconductor element has a first electrode and a second electrode located on opposite sides in the thickness direction. The substrate has an insulating base and a conductive plate. The base has first and second surfaces located on opposite sides in the thickness direction. The conductive plate is bonded to the first surface of the base and electrically connected to the second electrode of the semiconductor element. The lead has an island electrically connected to the first electrode. The sealing resin member covers at least the semiconductor element. |
| 申请公布号 |
US2015340350(A1) |
申请公布日期 |
2015.11.26 |
| 申请号 |
US201514717757 |
申请日期 |
2015.05.20 |
| 申请人 |
ROHM CO., Ltd. |
发明人 |
KOGA Akihiro |
| 分类号 |
H01L25/16;H01L23/31;H01L25/07;H01L23/373;H01L23/00;H01L23/498;H01L23/367 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
at least one semiconductor element including a first electrode and a second electrode that are opposite to each other in a thickness direction; a substrate including an insulating base and a conductive plate, the insulating base including a first surface and a second surface that are opposite to each other in the thickness direction, the conductive plate being bonded to the first surface of the base and electrically connected to the second electrode of the semiconductor element; a lead including an island electrically connected to the first electrode; and a sealing resin member covering the semiconductor element. |
| 地址 |
Kyoto-shi JP |
