发明名称 METHOD FOR MANUFACTURING WOUND ELECTRONIC COMPONENT
摘要 The purpose of this invention is to provide a method that is used to manufacture a wound electronic component using twisted wires and makes it possible, when twisting a plurality of winding wires together, to minimize breakage thereof. This method for manufacturing a wound electronic component (1) includes a preparation step in which a chuck (C1) is used to grip a core (12) that has a winding-core section (14) and flanges (16 and 18), a first step in which part of each of a number of winding wires (20, 21) supplied from respective nozzles (N1, N2) is affixed to one of the flanges (16), and a second step in which the chuck (C1) is rotated so as to twist the winding wires (20, 21).
申请公布号 WO2015178165(A1) 申请公布日期 2015.11.26
申请号 WO2015JP62565 申请日期 2015.04.24
申请人 MURATA MANUFACTURING CO., LTD. 发明人 YAMAKITA TAKAYUKI
分类号 H01F41/06;H01F41/04 主分类号 H01F41/06
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