INTEGRATED CIRCUITS WITH LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR STRUCTURES AND METHODS FOR FABRICATING THE SAME

摘要

Integrated circuits with improved laterally diffused metal oxide semiconductor (LDMOS) structures, and methods of fabricating the same, are provided. An exemplary LDMOS integrated circuit includes a p-type semiconductor substrate, an n-type epitaxial layer disposed over and in contact with the p-type semiconductor substrate, and a p-type implant layer disposed within the n-type epitaxial layer, wherein the p-type implant layer is not in contact with the p-type semiconductor substrate. It further includes an n-type reduced surface field region disposed over and in contact with the p-type implant layer, a p-type body well disposed on a lateral side of the p-type implant layer and the n-type reduced surface field region, and a shallow trench isolation (STI) structure disposed within the n-type reduced surface field region. Still further, it includes a gate structure disposed partially over the p-type body well, partially over the n-type surface field region, and partially over the STI structure.

主权项

1. A laterally diffused metal oxide semiconductor (LDMOS) integrated circuit structure comprising:
a p-type semiconductor substrate; an n-type epitaxial layer disposed over and in contact with the p-type semiconductor substrate; a p-type implant layer disposed within the n-type epitaxial layer, wherein the p-type implant layer is not in contact with the p-type semiconductor substrate; an n-type reduced surface field region disposed over and in contact with the p-type implant layer; a p-type body well disposed on a lateral side of the p-type implant layer and the n-type reduced surface field region; a shallow trench isolation structure disposed within the n-type reduced surface field region; and a gate structure disposed partially over the p-type body well, partially over the n-type surface field region, and partially over the shallow trench isolation structure.