ADHESIVE FILM AND SEALING METHOD FOR ORGANIC ELECTRONIC DEVICE USING SAME

摘要

Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan´) at 60 to 100 °C of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same.