MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE, BACKLIGHT DEVICE AND MOUNTING SUBSTRATE

摘要

A mounting structure for a semiconductor device includes a semiconductor device including an external connection terminal (3) disposed at each of both ends in a longitudinal direction; and a mounting substrate (51) for mounting the semiconductor device thereon. The external connection terminal (3) has a metal region on a mounting surface for mounting the semiconductor device on the mounting substrate (51); a device-side mounting insulating region (34) is defined by the metal region; the mounting substrate (51) has on a mounting surface side thereof a land pattern (52) made of an electrically conductive material on an insulating region, to connect the external connection terminal (3); and the land pattern (52) is formed in a shape surrounding an end portion of the semiconductor device, and the land pattern (52) includes a land-side insulating region (54) that is an insulating region extending along the device-side mounting insulating region (34).