| 摘要 |
The present invention relates to a piezoelectric package. Provided is the piezoelectric package which comprises: a body in which a piezoelectric device is mounted, and which has a lower surface electrode electrically connected to the piezoelectric device provided on the bottom thereof; a groove unit formed on the bottom of the body; and a capacitor device provided in the groove unit, and electrically connected to the piezoelectric device. |
