发明名称 LEDパッケージ構造体
摘要 A light-emitting diode (LED) package structure includes a substrate (110), a first LED (120), a second LED (130), and a resin material (140). At least one enclosure (111) made of a transparent material formed on a surface of the substrate, and encloses and forms at least one area (112) on the substrate. The first LED and the second LED are disposed in the area and adjacent to each other, and the resin material is disposed in the area, and covers the first LED and the second LED. The LED package structure obtains desired illuminating lights by mixing lights respectively emitted by the first LED and the second LED.
申请公布号 JP5823111(B2) 申请公布日期 2015.11.25
申请号 JP20100217301 申请日期 2010.09.28
申请人 发明人
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
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