发明名称 脆性材料基板のブレイク方法
摘要 <p>The invention provides a method for breaking a brittle material substrate. According to the method, the brittle material substrate formed with protrusions is broken without damaging the protrusion. The breaking method breaks the lattice-shaped brittle material substrate W formed with the protrusions (13) protruded from surface of the substrate W by pressing breaking rods (22) from an inner side of the substrate W along cut grooves S formed between adjacent protrusions (13). The breaking method uses elastic sheets (16) formed with lattice-shaped recesses (15) corresponding to the protrusions (13), so as to cover the protrusions (13) in a way of being embedded in the recesses (15), and the substrate W is placed on a support means (21) in such a way that the elastic sheets (16) contact the support means (21), thereby breaking the substrate by pressing the breaking rods (22) from the inner side of the substrate W.</p>
申请公布号 JP5824365(B2) 申请公布日期 2015.11.25
申请号 JP20120006520 申请日期 2012.01.16
申请人 发明人
分类号 B28D5/00 主分类号 B28D5/00
代理机构 代理人
主权项
地址