| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of keeping a substrate in a clean state by preventing splash of processing liquid from being adhered to the substrate during processing by the processing liquid. <P>SOLUTION: A gas discharging nozzle 11 is formed in a circular ring shape with an opening 11g at the center, a plurality of outer gas discharging holes 11c arranged in two upper and lower rows are formed on a side surface 11b in the outside of a body 11a, and a plurality of inner gas discharging holes 11e arranged in one row are formed on a side surface 11d of the opening 11g. During processing, a substrate W is covered with gas from the outer gas discharge holes 11c and the inner gas discharging holes 11e and prevented from being adhered by liquid splash. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
