PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT

摘要

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows:
(A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds;
(B) a hydroxyl-containing compound having a molecular weight of 500 or more;
(C) a photo-cationic polymerization initiator; and
(D) a light-shielding material.